Enhanced die-down ball grid array and method for making the same
AssigneeBroadcom Corporation
InventorsReza-ur Rahman Khan, Sam Ziqun Zhao
Life of this patent
Estimating the term…
Abstract
An apparatus, system, and method for assembling a ball grid array (BGA) package is described. A stiffener/heat spreader is provided. A substrate has a first surface and a second surface. The substrate has a central window-shaped aperture that extends through the substrate from the first substrate surface to the second substrate surface. The first substrate surface is attached to a surface of the stiffener/heat spreader. A portion of the stiffener/heat spreader is accessible through the central window-shaped aperture. An IC die has a first surface and a second surface. The first IC die surface is mounted to the accessible portion of the stiffener/heat spreader. A drop-in heat spreader has a surface that is mounted to the second IC die surface.
Claims34
A ball grid array (BGA) package, comprising:
- a first heat spreader;
- a substrate having an opening that extends through said substrate, wherein said substrate is attached to a surface of said first heat spreader;
- an IC die having opposing first and second surfaces, wherein said first surface of said IC die is mounted to said first heat spreader through said opening, wherein said second surface of said IC die includes a contact pad;
- a second heat spreader having opposing first and second surfaces, said first surface of said second heat spreader mounted to said second surface of said IC die;
- and
- a wire bond having a first end and a second end, the first end being attached to said contact pad of said IC die, the second end being directly attached to said second surface of said second heat spreader.
A ball grid array (BGA) package, comprising:
- a first heat spreader;
- a substrate having an opening that extends through said substrate, wherein said substrate is attached to a surface of said first heat spreader;
- an IC die mounted to said first heat spreader through said opening;
- a second heat spreader mounted to said IC die, said second heat spreader has opposing first and second surfaces;
- and
- a wire bond having a first end and a second end, the first end being attached to a contact pad of said IC die, the second end being attached to said second heat spreader;
- wherein said second heat spreader has a ridge between said first surface and said second surface of said second heat spreader, and wherein said wire bond attaches to said ridge of said second heat spreader.
A ball grid array (IBGA) package, comprising:
- a first heat spreader;
- a substrate having an opening that extends through said substrate, wherein said substrate is attached to said first heat spreader;
- an IC die mounted to said first heat spreader through said opening;
- and
- a second heat spreader having a first surface, a second surface, and a ridge surface that at least partially surrounds said second surface, wherein said second and said ridge surfaces are opposed to said first surface;
- wherein said first surface of said second heat spreader is mounted to said IC die, wherein said second surface of said second heat spreader is configured to be attached to a printed circuit board.
Dependencies are inferred from the claim text.