US 7,402,905 B2Granted

Methods of fabrication of wafer-level vacuum packaged devices

AssigneeHoneywell International Inc.

InventorsMark H. Eskridge, Ijaz H. Jafri

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Abstract

An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to the one or more MEMS devices. The device also includes a first wafer having one or more silicon pins, wherein a first surface of the first wafer is bonded to a first surface of the device layer in such a manner that the one or more silicon pins are in electrical communication with the electrical leads. A second wafer, which may also have one or more silicon pins, is bonded to a second surface of the device layer. The first and second wafers are formed of borosilicate glass and the device layer is formed of silicon.

Claims11

Dependent claims

A hermetically sealed device comprising:

a device layer comprising one or more Micro Electro-Mechanical Systems (MEMS) devices, the device layer having a first surface and a second surface, the MEMs devices having a first electrical lead and a second electrical lead;
a first wafer includes borosilicate glass, the first wafer having a first surface and a second surface and a silicon in extending from the first surface to the second surface, wherein the first surface of the first wafer is bonded to the first surface of the device layer such that the silicon pin of the first wafer is in electrical communication with the first electrical lead of at least one MEMS device;
and
a second wafer having a first surface and a second surface and a silicon pin extending from the first surface to the second surface, wherein the first surface of the second wafer is bonded to the second surface of the device layer such that the silicon pin of the second wafer is in electrical communication with the second electrical lead of at least one MEMS device.

1 more element

Dependencies are inferred from the claim text.