Semiconductor package structure and method of manufacture
AssigneeSemiconductor Components Industries, LLC
InventorsShutesh Krishnan, Jatinder Kumar
Life of this patent
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Abstract
In one embodiment, a semiconductor package includes a conductive slug and columnar leads in spaced relationship thereto. The columnar leads are coupled to an electronic device attached to the slug, and are exposed at least on one side of the package opposite the die attach slug. The die attach slug is further exposed to provide a package configured in a slug up orientation.
Claims20
A semiconductor package having first and second opposing major surfaces comprising:
- a conductive slug having an electronic chip attached to one surface;
- a plurality of columnar leads in spaced relationship to the conductive slug, wherein each of the plurality of columnar leads includes a bonding projection, and wherein each of the plurality of columnar leads has a pair of opposing end faces that substantially overlap and that are substantially parallel to the first and second opposing major surfaces;
- conductive connective structures electrically coupling the electronic chip to the bonding projections;
- and
- an encapsulating layer covering portions of the conductive slug, the plurality of columnar leads, and the electronic chip, wherein at least one of the opposing end faces of each columnar leads is exposed on the first major surface, and wherein the conductive slug is exposed on the second major surface.
A molded semiconductor package structure having first and second opposing major surfaces comprising:
- a flag having a semiconductor device attached to one surface;
- a plurality of conductive pillars in spaced relationship with the flag, wherein each conductive pillar includes a bonding extension, and wherein each conductive pillar includes a pair of opposing faces that substantially overlap and that are substantially parallel to the first and second major surfaces;
- conductive connective structures electrically coupling the semiconductor device to the bonding extensions;
- and
- an encapsulation layer covering portions of the molded semiconductor package structure, wherein at least one of the opposing faces of at least a portion of each of the plurality of conductive pillars is exposed at the first major surface, and wherein the flag is exposed at the second major surface so that the molded semiconductor package structure is configured to be mounted in a slug up orientation when the molded semiconductor package structure is attached to a next level of assembly.
A method of forming a molded semiconductor package structure having first and second opposing major surfaces comprising the steps of:
- providing a lead frame having a flag and a plurality of conductive pillars in spaced relationship with the flag, wherein the each conductive pillar includes a bonding extension, and wherein each conductive pillar includes a pair of opposing faces that substantially overlap, and wherein the pair of opposing faces is substantially parallel to the first and second major surfaces;
- attaching a semiconductor device to one surface of the flag;
- attaching conductive connective structures to the semiconductor device and the bonding extensions;
- and
- forming an encapsulation layer covering portions of the molded semiconductor package structure, wherein at least one of the opposing faces of at least a portion of the plurality of conductive pillars is exposed at the first major surface, and wherein the flag is exposed at the second major surface so that the molded semiconductor package structure is configured to be mounted in a slug up orientation when the molded semiconductor package structure is attached to a next level of assembly.
Dependencies are inferred from the claim text.