Low crosstalk substrate for mixed-signal integrated circuits

An integrated circuit laminate, comprising:

• a generally planar metal substrate with a plurality of voids filled with an insulator;
• a plurality of insulation layers joined to said metal substrate;
• an active silicon integrated circuit layer coupled to said insulation layers;
• and
• a plurality of conductive walls coupled to said metal substrate transecting said insulation layers and said active silicon circuit layer,
• wherein a sensitive circuit of said active silicon layer is insulated from digital noise.

An integrated circuit laminate, comprising:

• a metal substrate with a plurality of insulation filled voids;
• an insulation layer disposed on said metal substrate and insulation filled voids;
• a plurality of active silicon integrated circuit layers disposed on said insulation layer;
• at least one inductor coupled to one of said active silicon integrated circuit layers;
• and
• a metal underpass connected to said inductor and disposed under said top active silicon circuit layer coupled to said inductor.