Packaging method for microstructure and semiconductor devices
AssigneeTexas Instruments Incorporated
InventorTerry Tarn
Life of this patent
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Abstract
A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.
Claims54
A package, comprising:
- a ceramic package substrate that comprises a plurality of ceramic layers forming a cavity having a supporting surface on which a microelectromechanical device formed on a second substrate that is bonded to the ceramic package substrate;
- a package lid that has at least a portion that is transmissive to visible light;
- a first metallization layer comprising a first metallization material on a surface of the ceramic package substrate, the first metallization layer being electrically isolated from circuitry within the ceramic package substrate;
- a second metallization layer comprising a second metallization material on a surface of the package lid;
- a solder bonding the ceramic package substrate to the package lid;
- and
- an embedded heater laminated between first and second ceramic layers of the ceramic package substrate, wherein the heater extends within the ceramic package substrate with two ends of the heater electrically connected to at least two electrical connection pads outside the ceramic package substrate.
A package comprising:
- a substrate with an opening, the substrate comprising a plurality of ceramic layers and the opening comprising a bottom surface;
- a microelectromechanical device located within the opening on the bottom surface;
- an at least partially transparent package lid attached to the substrate over the cavity, wherein the package lid and substrate are attached by a plurality of layers comprising
- a first metallization layer on the surface of the substrate;
- a second metallization layer on the surface of the package lid and electrically isolated from the rest of the package lid;
- a hermetic sealing material between the first metallization layer and the second metallization layer;
- wherein the plurality of layers are electrically isolated from circuitry within the substrate;
- and
- a heater in thermal connection with the hermetic sealing material such that the heater is capable of melting the hermetic sealing material, the heater comprising a first portion embedded within the plurality of ceramic layers and a second portion capable of being connected to an external electric power source.
A package comprising:
- a substrate comprising a plurality of ceramic layers and an embedded heater capable of being connected to an external power source;
- a microelectromechanical device located within an opening of the substrate;
- a lid over the opening and separated from the microelectromechanical device, the lid comprising at least a portion that is non-conductive and at least a portion that is transparent to light;
- and
- a stacked layer of materials sealing the lid to the substrate, the stacked layer of materials electrically isolated from other portions of the lid by the non-conductive portion of the lid and comprising
- a first metal in contact with a top layer of the plurality of ceramic layers,
- a second metal in contact with the non-conductive portion of the lid, and
- a melted solder between the first metal and the second metal,
- wherein the heater is capable of melting the solder and sealing the lid to the substrate without causing thermal damage to the microelectromechanical device.
Dependencies are inferred from the claim text.