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US 7,402,842 B2Granted
Light emitting diode package
AssigneeM/A-Com, Inc.
InventorJoel Lee Goodrich
Life of this patent
Estimating the term…
Abstract
A light emitting diode package and method of manufacturing the light emitting diode package are provided. The light emitting diode package includes a sub-mount portion and a frame portion extending from the sub-mount portion. The frame portion has angled walls and is configured to receive a light emitting diode therein.
Claims21
A light emitting diode package comprising:
- a sub-mount portion;
- and
- a frame portion extending from the sub-mount portion, the frame portion having angled walls and configured to receive a light emitting diode therein, and wherein each of the sub-mount portion and frame portion are formed from silicon wafers bonded together.
A light emitting diode assembly comprising:
- a sub-mount portion formed from a silicon substrate and defining a surface mount package for mounting light emitting diodes thereon;
- and
- a plurality of frame portions etched from a silicon wafer and forming a plurality of cavities defined by angled walls, the plurality of cavities each configured to receive at least one of the light emitting diodes therein and wherein at least one of the plurality of cavities includes a plurality of light emitting diodes therein.
A method of manufacturing a package for a light emitting diode, said method comprising:
- forming at least one sub-mount portion for mounting a light emitting diode thereon, the sub-mount portion having at least one protection element integrated therewith;
- forming separately at least one frame portion defining a cavity for receiving the light emitting diode therein, the frame portion having angled walls;
- the at least one frame portion attached to the at least one sub-mount portion;
- and
- forming a package for a light emitting diode from the at least one sub-mount portion and at least one frame portion, and wherein the at least one sub-mount portion and at least one frame portion are formed from silicon material.
2 more elements
Dependencies are inferred from the claim text.