Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board
AssigneeKabushiki Kaisha Toshiba
InventorDaigo Suzuki
Life of this patent
Estimating the term…
Abstract
An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed. A first wiring is disposed on a main surface of the insulating substrate in the second area and connects to the second wiring disposed in the first area and the terminal disposed in the third area through first and second interlayer connecting portions. With this configuration, the second wiring need not be disposed in the second area, so that flexibility in the second area used as a connecting portion increases.
Claims19
A printed circuit board, comprising:
- an insulating substrate including a first area corresponding to a printed circuit board body and a second area corresponding to a printed circuit board connecting portion which connects to the printed circuit board body;
- a first wiring disposed on a main surface of the insulating substrate in the second area;
- a first insulating film disposed in the first and second areas while covering the first wiring;
- a first interlayer connecting portion extending through the first insulating film, disposed near a boundary between the first and second areas, and electrically connecting to the first wiring;
- a second interlayer connecting portion extending through the first insulating film, disposed near an end portion of the second area, and electrically connecting to the first wiring;
- a second wiring disposed on the first insulating film in the first area and electrically connecting to the first interlayer connecting portion;
- and
- a first terminal disposed at the end portion of the second area and electrically connecting to the second interlayer connecting portion.
A magnetic disk device including a printed circuit board, the printed circuit board comprising:
- an insulating substrate including a first area corresponding to a printed circuit board body and a second area corresponding to a printed circuit board connecting portion which connects to the printed circuit board body;
- a first wiring disposed on a main surface of the insulating substrate in the second area;
- a first insulating film disposed in the first and second areas while covering the first wiring;
- a first interlayer connecting portion extending through the first insulating film, disposed near a boundary between the first and second areas, and electrically connecting to the first wiring;
- a second interlayer connecting portion extending through the first insulating film, disposed near an end portion of the second area, and electrically connecting to the first wiring;
- a second wiring disposed on the first insulating film in the first area and electrically connecting to the first interlayer connecting portion;
- and
- a first terminal disposed at the end portion of the second area and electrically connecting to the second interlayer connecting portion.
A method for manufacturing a printed circuit board, comprising:
- preparing an insulating substrate including a first area corresponding to a printed circuit board body and a second area corresponding to a printed circuit board connecting portion which connects to the printed circuit board body;
- forming a first wiring disposed on a main surface of the insulating substrate in the second area;
- forming a first insulating film disposed in the first and second areas while covering the first wiring;
- forming a first interlayer connecting portion extending through the first insulating film, disposed near a boundary between the first and second areas, and electrically connecting to the first wiring;
- forming a second interlayer connecting portion extending through the first insulating film, disposed near an end portion of the second area, and electrically connecting to the first wiring;
- forming a second wiring disposed on the first insulating film in the first area and electrically connecting to the first interlayer connecting portion;
- and
- forming a first terminal disposed at the end portion of the second area and electrically connecting to the second interlayer connecting portion.
Dependencies are inferred from the claim text.