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US 7,402,552 B2Granted
Non-corrosive cleaning composition for removing plasma etching residues
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsKenji Honda, Michelle Elderkin, Vincent Leon
Life of this patent
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Abstract
A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.
Claims11
A method for cleaning residue from a substrate, which comprises the step of:
- applying a cleaning composition to said substrate, wherein said composition consists of:
- (a) water;
- (b) at least one hydroxylammonium compound;
- (c) at least one basic compound, and
- (d) at least one organic carboxylic acid selected from the group consisting of:
- lactic acid, citric acid, formic acid, oxalic acid, acetic acid, propionic acid, valeric acid, isovaleric acid, malonic acid, succinic acid, glutaric acid, maleic acid, fumaric acid, phthalic acid, 1,2,3-benzenetricarboxylic acid, glycolic acid, salicylic acid, tartaric acid, and gluconic acid, wherein said carboxylic acid is present in an amount between about 0.01 wt. % to 10 wt. % based on the total weight of the composition.
3 more elements
Dependencies are inferred from the claim text.