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US 7,402,525 B2Granted
Method for manufacturing semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShigeharu Monoe
Life of this patent
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Abstract
A gate electrode is formed of a laminate structure comprising a plurality of conductive layers such that the width along the channel of a lower first conductive layer is larger than that of an upper second conductive layer The gate electrode is used as a mask during ion doping for forming an LDD. A mask pattern for forming the gate electrode is processed into an optimum shape in combination with dry etching so that the LDD overlapping with the gate electrode(Lov) is 1 μm or more, and preferably, 1.5 μm or more.
Claims45
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer comprising a lower first conductive layer and an upper second conductive layer over a substrate;
- forming a mask pattern over the laminate layer;
- forming a first conductive layer pattern having a tapered edge by etching the second conductive layer and the first conductive layer using the mask pattern;
- after forming the first conductive layer pattern, recessing an edge of the mask pattern remaining on the first conductive layer pattern;
- and
- after recessing the edge of the mask pattern, forming a second conductive layer pattern by selectively etching the second conductive layer in the first conductive layer pattern in accordance with the recessed mask pattern using a processing step different from a processing step used to recess the edge of the mask pattern remaining on the first conductive layer pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate by sequentially depositing a first conductive layer, a second conductive layer, and a third conductive layer;
- forming a mask pattern on the laminate layer;
- forming a first conductive layer pattern having a tapered edge by etching the third conductive layer, the second conductive layer, and the first conductive layer using the mask pattern;
- after forming the first conductive layer pattern, recessing an edge of the mask pattern remaining on the first conductive layer pattern;
- and
- after recessing the edge of the mask pattern, forming a second conductive layer pattern by selectively etching the third conductive layer and the second conductive layer in the first conductive layer pattern in accordance with the recessed mask pattern using a processing step different from a processing step used to recess the edge of the mask pattern remaining on the first conductive layer pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer comprising a lower first conductive layer and an upper second conductive layer over a substrate;
- forming a mask pattern on the laminate layer;
- decreasing a taper angle of an edge of the mask pattern by performing plasma treatment;
- after decreasing the taper angle, forming a first conductive layer pattern having a tapered edge by etching the second conductive layer and the first conductive layer of the laminate layer by using the mask pattern;
- and
- after forming the first conductive layer pattern, forming a second conductive layer pattern by selectively etching the second conductive layer in the first conductive layer pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate by sequentially depositing a first conductive layer, a second conductive layer, and a third conductive layer;
- forming a mask pattern on the laminate layer;
- etching the third conductive layer and decreasing taper angle of an edge of the mask pattern by performing plasma treatment;
- after etching the third conductive layer and decreasing the taper angle, forming a first conductive layer pattern having a tapered edge by etching the second conductive layer and the first conductive layer of the laminate layer by using the mask pattern;
- and
- after forming the first conductive layer pattern, forming a second conductive layer pattern by selectively etching the second and third conductive layers in the first conductive layer pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer comprising a lower first conductive layer and an upper second conductive layer over a substrate;
- forming a first shaped mask pattern over the laminate layer;
- forming a first conductive layer pattern having a tapered edge and a second shaped mask pattern by etching the second conductive layer and the first conductive layer;
- removing a portion of the second shaped mask pattern remaining on the first conductive layer pattern to form a third shaped mask pattern;
- and
- forming a second conductive layer pattern by selectively etching the second conductive layer in the first conductive layer pattern in accordance with the third shaped mask pattern using a processing step different from a processing step used to form the third shaped mask pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate by sequentially depositing a first conductive layer, a second conductive layer, and a third conductive layer;
- forming a first shaped mask pattern over the laminate layer;
- forming a first conductive layer pattern having a tapered edge and a second shaped mask pattern by etching the third conductive layer, the second conductive layer and the first conductive layer;
- removing a portion of the second shaped mask pattern remaining on the first conductive layer pattern to form a third shaped mask pattern;
- and
- forming a second conductive layer pattern by selectively etching the third conductive layer and the second conductive layer in the first conductive layer pattern in accordance with the third shaped mask pattern using a processing step different from a processing step used to form the third shaped mask pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer and a second layer formed over the first layer;
- forming a first mask pattern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the second layer and the first layer using the first mask pattern;
- after forming the first laminate layer pattern, forming a second mask pattern by removing at least a side portion of the first mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the second layer extends beyond a side edge of the second mask pattern;
- and
- after forming the second mask pattern, forming a second laminate layer pattern by etching at least the portion of the second layer in accordance with the second mask pattern;
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
4 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer, a second layer formed over the first layer and a third layer formed over the second layer;
- forming a first mask pattern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the third layer, the second layer and the first layer using the first mask pattern;
- after forming the first laminate layer pattern, forming a second mask pattern by removing at least a side portion of the first mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the third layer and the second layer extends beyond a side edge of the second mask pattern;
- and
- after forming the second mask pattern, forming a second laminate layer pattern by etching at least the portion of the third layer and the second layer in accordance with the second mask pattern;
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
4 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer and a second layer formed over the first layer;
- forming a first mask paftern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the second layer and the first layer using the first mask pattern;
- after forming the first laminate layer pattern, forming a second mask pattern by removing at least a side portion of the first mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the second laminate layer pattern extends beyond a side edge of the second mask pattern;
- and
- after forming the second mask pattern, forming a second laminate layer pattern by etching at least the portion of the second laminate layer pattern in accordance with the second mask pattern;
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
4 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer, a second layer formed over the first layer, and a third layer formed over the second layer;
- forming a first mask paftern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the third layer, the second layer, and the first layer using the first mask pattern;
- after forming the first laminate layer pattern, forming a second mask pattern by removing at least a side portion of the first mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the second laminate layer pattern extends beyond a side edge of the second mask pattern, and
- after forming the second mask pattern, forming a second laminate layer pattern by etching at least the portion of the second laminate layer pattern in accordance with the second mask pattern,
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
3 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer and a second layer formed over the first layer;
- forming a mask pattern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the second layer and the first layer using the mask pattern;
- after forming the first laminate layer pattern, removing at least a side portion of the mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the second layer extends beyond a side edge of the mask pattern;
- and
- forming a second laminate layer pattern by etching at least the portion of the second layer in accordance with the mask pattern;
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
4 more elements
A method for manufacturing a semiconductor device comprising:
- forming a laminate layer over a substrate, the laminate layer comprising a first layer, a second layer formed over the first layer, and a third layer formed over the second layer, wherein the third layer is a conductive layer;
- forming a mask pattern comprising a photoresist over the laminate layer;
- forming a first laminate layer pattern by etching the third layer, the second layer, and the first layer using the mask pattern;
- after forming the first laminate layer pattern, removing at least a side portion of the mask pattern remaining on the first laminate layer pattern by oxygen plasma treatment so that a portion of the third layer and the second layer extends beyond a side edge of the mask pattern, and
- forming a second laminate layer pattern by etching at least the portion of the third layer and the second layer in accordance with the mask pattern;
- wherein at least a portion of the first layer extends beyond a side edge of the second layer in the second laminate layer pattern.
3 more elements
Dependencies are inferred from the claim text.