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US 7,402,521 B2Granted
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
AssigneeKabushiki Kaisha Toshiba
InventorsYukiteru Matsui, Gaku Minamihaba, Atsushi Shigeta, Hiroyuki Yano
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Abstract
There is proposed a polishing method. The method includes feeding a slurry onto a polishing pad, press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon, and chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head.
Claims20
A polishing method comprising:
- feeding a slurry onto a polishing pad;
- press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon;
- and
- chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head while feeding the slurry on the polishing pad, during repeating the sequence, the semiconductor substrate being kept press-contacted with the polishing pad.
1 more element
A method for manufacturing a semiconductor device comprising:
- forming a recess in a semiconductor substrate or in an insulating film deposited above the semiconductor substrate each employed as an underlying layer;
- forming a resist film above the underlying layer having the recess;
- and
- chemically mechanically polishing the resist film to selectively bury the resist film in the recess;
- wherein the chemically mechanically polishing of the resist film is performed by:
- repeating a sequence of rotation and halt of rotation of a polishing pad and a polishing head while feeding a slurry on the polishing pad, and press-contacting the semiconductor substrate held on the polishing head with the polishing pad, the semiconductor substrate having the resist film thereon, during repeating the sequence, the semiconductor substrate being kept press-contacted with the polishing pad.
3 more elements
Dependencies are inferred from the claim text.