Configuration for testing the bonding positions of conductive drops and test method for using the same

A method for testing bonding position of conductor, applied to a plurality of panels, and the method comprising steps of:

• providing a configuration on each panel, and the configuration comprising:
• two contact pads provided on the panel, at least one of the contact pads is approximately coincident with a dropping position for a conductor, and each contact pad comprising:
• two conductive members;
• and
• an insulating means interposing conductive members, wherein for the contact pad that is approximately coincident with the dropping position, at least a portion of the conductive members of that contact pad are included in the dropping position;
• a connection wire connecting one conductive member of one contact pad to one conductive member of another contact pad;
• and
• at least two test wires connecting the other conductive members of the contact pads;
• wherein the conductive members of the contact pads are electrically connected when a conductor is provided at the dropping position;
• dividing the panel into several groups, and each group of the panels electrically connected from a first panel to a last panel;
• providing a plurality of conductors on the contact pads;
• and
• testing whether each group of the panels is conductive.