Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
AssigneeSeiko Epson Corporation
InventorTsuyoshi Kaneko
Life of this patent
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Abstract
The invention provides a bump structure whose mounting position, shape, and size are favorably controlled and to a method of manufacturing the same. The bump structure of the invention can be provided on an insulating layer and includes a protruding part made of resin obtained by hardening a liquid material and a conductive layer that covers the protruding part. The protruding part can be obtained by forming a liquid-repelling part with a liquid-repelling characteristic for the liquid material and a liquid-attracting part that is more wettable than the liquid-repelling part for the liquid material on an upper surface on the insulating layer, discharging the liquid material onto the liquid-attracting part, and then hardening the liquid material.
Claims4
A method of manufacturing a bump structure, comprising:
- forming a liquid-repelling part with a liquid-repelling characteristic for droplets and a liquid-attracting part that is more wettable than the liquid-repelling part for the droplets on an upper surface of an insulating layer, the droplets including a precursor of UV-hardening resin, forming the liquid-repelling part including using a plasma treatment;
- discharging the droplets onto the liquid-attracting part to form a protruding part precursor;
- hardening the protruding part precursor by applying UV rays to form a protruding part;
- forming the protruding part directly on the insulating layer;
- and
- forming a conductive layer so as to cover the protruding part,
- discharging the droplets comprising discharging the droplets directly on the insulating layer without a conductor between the droplets and the insulating layer.
Dependencies are inferred from the claim text.