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US 7,402,507 B2Granted
Semiconductor package fabrication
AssigneeInternational Rectifier Corporation
InventorsMartin Standing, Mark Pavier, Robert J. Clarke, Andrew Sawle, Kenneth McCartney
Life of this patent
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Abstract
A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
Claims22
A method of preparing a semiconductor package comprising:
- identifying a reference mark on a semiconductor package component;
- positioning a drop on demand head capable of depositing drop depositable material based on said identified reference mark;
- and
- depositing said depositable material on a surface of said semiconductor package component to realize a pattern.
1 more element
A method for fabricating a semiconductor device comprising:
- forming a conductive body, said conductive body including a material susceptible to consumption by a solder;
- depositing a barrier atop said conductive body, said barrier being capable of preventing the consumption of said material that is susceptible of consumption;
- and
- depositing a solderable body atop said barrier;
- wherein said barrier is deposited through a drop on demand process, or said barrier is screen printed.
2 more elements
A method of fabricating an MCM comprising:
- drop on demand depositing conductive tracks and dielectric bodies on a leadframe to form an integrated circuit body capable of receiving semiconductor devices;
- and
- drop on demand depositing of identifying indicia on said leadframe.
Dependencies are inferred from the claim text.