Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
AssigneeSeiko Epson Corporation
InventorKazumi Hara
Life of this patent
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Abstract
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, has a substrate and an adhesion layer which is formed at one surface side of the substrate, in which a concave portion is formed on a surface of the adhesion layer, and the concave portion is formed so that a convex shape member projected from an adhesion surface of the electronic-component aggregation which is adhered to the dicing sheet is inserted.
Claims22
A manufacturing method of a dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, the manufacturing method comprising:
- forming an adhesion layer so as to cover one surface side of a support member, and forming a concave portion in which a convex shape member projected from the electronic-component aggregation is inserted on a surface of the adhesion layer.
A manufacturing method of a dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, the manufacturing method comprising:
- attaching an adhesion sheet which is provided with a concave portion at a position corresponding to the convex shape member projected from the electronic-component aggregation to one surface side of a support member.
A manufacturing method of a semiconductor apparatus for separating a plurality of semiconductor chips which are formed on a semiconductor wafer, the manufacturing method comprising:
- laying a dicing sheet which is provided with a support member, and an adhesive layer which is formed so as to cover one surface side of the support member;
- forming a concave portion in which a convex shape member projected from the semiconductor wafer is inserted on a surface of the adhesive layer of the dicing sheet;
- inserting the convex shape member into the concave portion of the adhesive layer;
- adhering the semiconductor wafer and the adhesive layer to each other;
- and cutting the
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, comprising:
- a support member;
- and an adhesion layer which is formed so as to cover one surface side of the support member, wherein a concave portion is formed on a surface of the adhesion layer, and the concave portion is formed so that a convex shape member projected from an adhesion surface of the electronic-component aggregation which is adhered to the dicing sheet is inserted.
Dependencies are inferred from the claim text.