Method for production of contactless chip cards and for production of electrical units comprising chips with contact elements
OwnerAndreas Plettnerinventor
Life of this patent
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Abstract
Method of producing electrical units consisting of chips with contact elements, wherein the contact elements are suited for the direct connection with contact terminals of external electric components in an electrically conductive manner, wherein the connection of the contact elements with the chips is effected before the individual chips are removed from the grouping predefined by the wafer and consisting of rows and columns, and the contact elements are made of a metallized plastic foil or metallic foil to be applied onto the chips.
Claims50
A method of producing electrical units comprising chips with contact elements wherein the contact elements are suited for direct connection with contact terminals of external electric components in an electrically conductive fashion, comprising:
- each chip has an active surface with at least one bond pad and a non-active surface arranged opposite the active surface, and
- the connection of the contact elements with at least one bond pad of the chips is effected before the individual chips are removed from a grouping predefined on a wafer and comprising of rows and columns
- wherein the contact elements are made of a flexible foil to be applied onto the chips, and
- each contact element is constructed such that it has a form and length permitting the contact element after the removal of a corresponding electrical unit from the grouping to reach the plane which coincides with the non-active surface of the chip, the length of each contact element being approximately a length of the flexible foil between bond pads on adjacent chips in the grouping.
A method of producing contactless chip cards for producing an electrical connection between bond pads of respective chips and contact terminals of respective antenna:
- producing chip contact element units by connecting contact elements with the bond pads of the respective chips prior to removing the individual chips from a grouping predefined by the wafer, wherein the contact elements are made from a flexible foil by cutting the flexible foil at a location next to the bond pad of an adjacent second chip such that the cutting forms the contact element with a length approximately equal to the length between the bond pad of the first chip and the bond pad of the adjacent second chip;
- individualizing the corresponding chip contact element units;
- gripping the individual chip contact element units and placing the respective unit onto a substrate having an antenna structure;
- and
- connecting the chip contact element units with the contact terminals of the antenna.
A method of producing chips having contact elements, the method comprising:
- forming a first plurality of three or more chips on a wafer, each chip having a first bond pad and a second bond pad;
- applying a first flexible foil comprising metal to the first bond pads of the first plurality of chips on the wafer, the first flexible foil forming respective contact elements for the first bond pads of the chips in the first plurality of chips;
- applying, parallel to the first flexible foil, a second flexible foil comprising metal to the second bond pads of the first plurality of chips on the wafer, the second flexible foil forming respective contact elements for the second bond pads of the chips in the first plurality of chips;
- cutting the first and second flexible foils to separate the first plurality of chips;
- and
- subsequently removing the first plurality of chips from the wafer.
A method of producing electrical units, comprising:
- forming a plurality of at least three chips aligned in a column on a wafer portion, each of the plurality of chips having at least two bond pads;
- affixing a plurality of pre-structured contact elements to a plastic foil material, the pre-structured contact elements having a length approximately equal to a length between a first bond pad of a first chip in the plurality of chips and a first bond pad of an adjacent chip in the plurality chips;
- affixing a second plurality of pre-structured contact elements to the plastic foil material, the second plurality of pre-structured contact elements having a length approximately equal to a length between a second bond pad of the first chip in the plurality of chips and a second bond pad of the adjacent chip in the plurality chips;
- and
- bonding a portion of the pre-structured contact elements to the respective bond pads of the chips in the column to connect the pre-structured contact elements with the respective bond pads of the chips.
Dependencies are inferred from the claim text.