Molded integrated circuit package with exposed active area
AssigneeSTMicroelectronics S.r.l.
InventorsTiao Zhou, Michael J. Hundt
Life of this patent
Estimating the term…
Abstract
An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.
Claims19
A method of packaging exposed active area sensors comprising steps of:
- utilizing a compliant die attachment to secure an integrated circuit die having a surface region which must remain exposed after packaging within a transfer mold during encapsulation of the integrated circuit die,
- wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and
- wherein the compliant die attachment comprises:
- a flexible and compressible substrate mounted on a rigid base, and
- a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
A method of packaging exposed active area sensors comprising steps of:
- securing an integrated circuit die having a surface region which must remain exposed after packaging using a compliant die attachment;
- and
- clamping the integrated circuit die and a substrate in a transfer mold,
- wherein the compliant die attachment deforms, as necessary, in response to contact of a portion of the transfer mold with the surface region which must remain exposed after packaging, and
- wherein the compliant die attachment comprises:
- a flexible and compressible substrate mounted on a rigid base, and
- a compliant adhesive disposed only at locations proximate to a periphery of the integrated circuit die.
Dependencies are inferred from the claim text.