Microelectronic imaging units and methods of manufacturing microelectronic imaging units

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs comprises screen or stencil printing the stand-offs onto the corresponding imaging dies.

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs comprises imprinting a plurality of openings over corresponding external contacts.

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs comprises building a plurality of stand-offs via stereolithography.

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs comprises building a plurality of stand-offs having openings aligned with corresponding external contacts.

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs comprises forming a plurality of openings over corresponding external contacts;
• and electrically connecting the external contacts comprises wire-bonding the external contacts to the terminals with the wire-bonds partially received in corresponding openings.

A method of manufacturing a plurality of imaging units, the method comprising:

• coupling a plurality of singulated imaging dies to a support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated, the individual stand-offs including a portion between adjacent external contacts;
• and
• electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member,
• wherein forming the stand-offs on the imaging dies comprises:
• building the stand-offs on a plurality of covers;
• and attaching the stand-offs and the covers to the corresponding imaging dies after building the stand-offs on the covers.