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US 7,402,446 B2Granted
Method of manufacturing an electroluminescence device
AssigneeSeiko Epson Corporation
InventorHiroshi Koeda
Life of this patent
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Abstract
A semiconductor device is provided. The semiconductor device includes an element; a mounting board; and a single film made of a conductive material directly coupling the element with the mounting board.
Claims10
A method of manufacturing a semiconductor device, comprising:
- a first step of selecting a specific element among a plurality of elements provided on a forming board by covering non-selected elements with a separation layer;
- a second step of providing a wiring formed on the separation layer and electrically connected the specific element to the wiring, wherein the second step is performed after the first step and the separation layer is formed between the wiring layer and at least one of the elements;
- a third step of joining the forming board and a mounting board together, including printing the specific element and the wiring on the mounting board and bonding the mounting board to an insulating layer;
- a fourth step of irradiating an amorphous layer on said forming board and removing the separation layer from the semiconductor device;
- a fifth step of removing the forming board including the non-selected elements from the mounting board;
- a sixth step of electrically connecting an inter-board conductive part to the wiring;
- and
- a seventh step of joining the mounting board to an electroluminescence board including electrically connecting the inter-board conductive part to a negative electrode of an electroluminescence element.
5 more elements
A method of manufacturing an electroluminescence device including a thin-film transistor board having a thin-film transistor and an electroluminescence board having an electroluminescence element, comprising:
- forming the thin-film transistor board by using a method of manufacturing a semiconductor device including:
- a first step of selecting a specific element among a plurality of elements provided on a forming board by covering non-selected elements with a separation layer;
- a second step of providing a wiring formed on the separation layer and electrically connecting the specific element to the wiring, wherein the second step is performed after the first step and the separation layer is formed between the wiring layer and at least one of the elements;
- a third step of joining the forming board and a mounting board together, including printing the specific element and the wiring on the mounting board and bonding the mounting board to an insulating layer;
- a fourth step of irradiating an amorphous layer on said forming board and removing the separation layer from the semiconductor devise;
- a fifth step of removing the forming board including the non-selected elements from the mounting board;
- a sixth step of electrically connecting an inter-board conductive part to the wiring;
- and
- a seventh step of joining the mounting board to an electroluminescence board including electrically connecting the inter-board conductive part to a negative electrode of an electroluminescence element.
6 more elements
Dependencies are inferred from the claim text.