Stripping and removal of organic-containing materials from electronic device substrate surfaces
AssigneeApplied Materials, Inc.
InventorSteven Verhaverbeke
Life of this patent
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Abstract
Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising ozone (O3) in a solvent, where the solvent comprises acetic anhydride. The stripping solvent used to form the stripping solution may comprise a mixture of acetic anhydride with a co-solvent selected from the group consisting of a carbonate containing 2-4 carbon atoms, ethylene glycol diacetate, and combinations thereof. In some instances, the stripping solution may contain only acetic anhydride and ozone, where the ozone concentration is typically about 300 ppm or greater.
Claims28
A method of removing an organic-containing material from a surface of a substrate, comprising:
- providing a substrate comprising at least one of a semiconductor device substrate, a flat panel display substrate, or a solar cell array and having an organic-containing material disposed on a surface thereof;
- and
- removing the organic-containing material by exposing said surface of said substrate to a stripping solution comprising ozone (O3) in a solvent, wherein a concentration of ozone in the solution is about 50 ppm or greater, and wherein said solvent comprises acetic anhydride.
A method of removing an organic-containing material from a surface of a substrate, comprising:
- providing a substrate comprising at least one of a semiconductor device substrate, a flat panel display substrate, or a solar cell array and having an organic-containing material disposed on a surface thereof, wherein said surface includes exposed metal;
- and
- removing the organic-containing material by exposing said surface including said exposed metal to a stripping solution comprising ozone (O3) in a solvent, wherein a concentration of ozone ranges from about 50 ppm to about 600 ppm, and wherein said solvent comprises acetic anhydride.
A method removing an organic-containing material from a substrate, comprising:
- providing a substrate comprising at least one of a semiconductor device substrate, a flat panel display substrate, or a solar cell array and having an organic-containing material disposed on a surface thereof;
- and
- removing the organic-containing material by exposing said surface to a vaporous stripping solution comprising ozone (O3) in combination with a vaporous solvent, wherein a concentration of ozone in the solution is about 50 ppm or greater, and wherein said vaporous solvent comprises acetic anhydride.
A method of removing an organic-containing material from a substrate, comprising:
- providing a substrate comprising at least one of a semiconductor device substrate, a flat panel display substrate, or a solar cell array and having an organic-containing material disposed on a surface thereof, wherein said surface includes exposed metal;
- and
- removing the organic-containing material by exposing said surface including said exposed metal to a vaporous stripping solution comprising ozone (O3) in combination with a vaporous solvent, wherein a concentration of ozone ranges from about 50 ppm to about 600 ppm, and wherein said vaporous solvent comprises acetic anhydride.
Dependencies are inferred from the claim text.