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US 7,402,048 B2Granted
Technique for blind-mating daughtercard to mainboard
AssigneeIntel Corporation
InventorsPascal C. Meier, Michael W. Leddige, Mohiuddin Mazumder, Mark Trobough, Alok Tripathi, Ven R. Holalkere
Life of this patent
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Abstract
An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
Claims12
An apparatus comprising:
- a printed circuit board (PCB);
- a first flexible conductive cable secured to the PCB;
- a first daughtercard having an end adjacent to the PCB;
- a second flexible conductive cable secured to the first daughtercard;
- a first connector which provides an electrically conductive connection between the first flexible conductive cable and the second flexible conductive cable, the first connector positioned to sandwich a portion of the first flexible conductive cable between the first connector and the PCB;
- a second daughtercard having an end adjacent the PCB;
- a third flexible conductive cable secured to the second daughter card;
- and
- a second connector which provides an electrically conductive connection between the first flexible conductive cable and the third flexible conductive cable;
- wherein the second connector is positioned to sandwich another portion of the first flexible conductive cable between the second connector and the PCB.
7 more elements
Dependencies are inferred from the claim text.