Detection of defects by thermographic analysis
AssigneeART, Advanced Research Technologies Inc.
InventorsJerry Schlagheck, Marc Pastor
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AssigneeART, Advanced Research Technologies Inc.
InventorsJerry Schlagheck, Marc Pastor
Estimating the term…
A mechanism is provided for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, the populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more Surface Mounted Components. The mechanism exploits a standard thermographic image which may be used in a detection method comprising 1) directing a thermal wave at said second side of said populated sample 2) recording a thermographic image of the first side of said populated sample once a surface thereof reaches a predetermined transit temperature or a predetermined transit time period has elapsed; and 3) analysing the obtained thermographic image by comparing the so obtained thermographic image with a standard thermographic image.
A method for detecting a defect in a populated circuit board, said populated circuit board having a first side and an opposite second side, at least said first side being populated with one or more surface mounted components:
A method for detecting a defect in a populated circuit board, said populated circuit board having a first side and a second opposite side, at least said first side being populated with one or more surface mounted components, said method comprising:
A method for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, said populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more surface mounted components, said method comprising:
A method for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, said sample having a first side and a second opposite side, at least said first side of said populated sample having one or more surface mounted components, said method comprising:
A method for obtaining a standard thermographic image for use in detecting a defect in a populated circuit board, said populated circuit board having a first side and a second opposite side, at least said first side being populated with one or more surface mounted components, said method comprising:
A method for obtaining a standard thermographic image for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, said sample having a first side and a second opposite side, at least said first side of said populated sample having one or more surface mounted components, said method comprising
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