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US 7,401,642 B2Granted
Heat sink with heat pipes
AssigneeHon Hai Precision Industry Co., Ltd.
InventorWei-Ta Lo
Life of this patent
Estimating the term…
Abstract
A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates 40. Each heat pipe 20 has a horizontal heat absorbing portion 22 attached to the base 10, and two heat dissipation portions 24 extending perpendicularly from opposite ends of the heat absorbing portion 22 and through the side plates 40.
Claims11
A heat sink for integrated circuit package comprising:
- a heat receiving member,
- a heat pipe unit attached to the heat receiving member, the heat pipe unit comprising a pair of heat dissipation portions extending away from the heat receiving member,
- a pair of side plates attached to the heat dissipation portions of the heat pipe unit respectively;
- and
- a plurality of spaced fins sandwiched between the side plates for dissipating heat transferred from the side plates, wherein the plurality of spaced fins are perpendicular to the pair of side plates.
2 more elements
Dependencies are inferred from the claim text.