Arrangement for transferring information/structures to wafers

A method of manufacturing a semiconductor wafer, the method comprising:

• positioning a semiconductor wafer on a chuck, the semiconductor wafer including alignment marks formed thereon and a patterning layer formed thereon;
• aligning the wafer in a φ direction;
• after aligning the wafer in the φ direction, positioning a stamp over the semiconductor wafer, the stamp including a plurality of elevated structures disposed on an upper surface thereof and corresponding to a pattern to be applied to the patterning layer of the wafer, the stamp further including alignment marks that correspond to the alignment marks of the semiconductor wafer, the stamp having a diameter dimension that approximately corresponds to a diameter dimension of the semiconductor wafer;
• aligning the stamp with the wafer by use of the alignment marks of the semiconductor wafer and of the stamp, wherein aligning the stamp comprises positioning the stamp on the semiconductor wafer by means of an infrared positioning system, and wherein the infrared position system includes a plurality of infrared light sources and a plurality of infrared cameras, wherein each alignment mark on the stamp is aligned with a corresponding alignment mark on the semiconductor wafer using one of the infrared light sources to illuminate the corresponding alignment mark and one of the infrared cameras to monitor the corresponding alignment marks;
• and
• physically contacting the elevated structures of the stamp with the patterning layer of the semiconductor wafer.