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US 7,401,403 B2Granted
Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
AssigneePalo Alto Research Center Incorporated
InventorsBaomin Xu, Stephen D. White, Steven A. Buhler
Life of this patent
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Abstract
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
Claims30
A method comprising:
- depositing ceramic material into a mold disposed on a temporary substrate;
- removing the mold to obtain molded elements comprising the material, wherein the removing of the mold comprises exposing the mold to a relatively high temperature in an oxidizing environment to burn out the mold;
- sintering the molded elements;
- bonding the molded elements to a target substrate;
- and,
- removing the temporary substrate.
3 more elements
A method comprising:
- depositing ceramic material into a mold disposed on a temporary substrate;
- removing the mold to obtain molded elements comprising the material;
- sintering the molded elements;
- bonding the molded elements to a target substrate;
- and,
- removing the temporary substrate, wherein the removing of the temporary substrate comprises use of laser liftoff technique wherein the ceramic material is exposed to an excimer laser source through the temporary substrate.
3 more elements
Dependencies are inferred from the claim text.