Method of manufacturing a substrate heating device
AssigneeNGK Insulators, Ltd.
InventorsYutaka Unno, Yoshinobu Goto, Taiji Kiku
Life of this patent
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Abstract
A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.
Claims21
A manufacturing method for a substrate heating device, comprising:
- forming a base plate having a substrate heating surface in which a resistance heating element is buried;
- forming a tubular member;
- joining the tubular member to the base plate;
- then joining a power supply member housed in the tubular member to the resistance heating element;
- then measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element;
- grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution;
- measuring the temperature distribution in the substrate heating surface again;
- and
- performing another grinding step to achieve 0° C.≦(To−Tc)≦5° C., wherein (To−Tc) is the temperature difference between the temperatures at the peripheral and central parts of the substrate heating surface.
A manufacturing method for a substrate heating device, comprising:
- forming a base plate having a substrate heating surface in which a resistance heating element is buried;
- forming a tubular member;
- joining the tubular member to the base plate;
- measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element;
- and
- grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution,
- wherein the tubular member is ground such that the base plate and the tubular member have a relation of
- 10≦Ds/t1≦90
- Ds denotes an external diameter at a junction of the base plate and the tubular member, and
- t1 denotes a thickness of the tubular member after grinding except for a junction region with the base plate.
A manufacturing method for a substrate heating device, comprising:
- forming a base plate having a substrate heating surface in which a resistance heating element is buried;
- forming a tubular member;
- joining the tubular member to the base plate;
- measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element;
- and
- grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution,
- wherein the tubular member is ground such that a thickness t0 of the tubular member before grinding and a thickness t1 of the tubular member after grinding have a relation of t0−t1≦4 mm and t1≧0.5 mm.
Dependencies are inferred from the claim text.