Method for removing solder bumps from LSI

A solder removing system for removing solder bumps adhering to an LSI, comprising:

• a heater having a flat-shaped upper surface;
• a Cu plate being mounted on said upper surface of a heater and having an upper surface on which the LSI is placed so as to cause molten solder bumps to adhere thereto;
• a weight being mounted on top of the LSI for adding a load to the LSI;
• a suction unit positioned over said heater;
• and
• a moving unit for moving either said heater or said suction unit in a X-Y-Z directions;
• wherein said heater heats said Cu plate and the LSI to melt solder bumps and transferring those solder bumps to said Cu plate;
• wherein said moving unit moves either said heater or said suction unit so as to position said suction unit at a location a predetermined distance away from a top surface of said weight;
• and
• wherein said suction unit attracts said weight and the LSI so as to separate the LSI from said Cu plate.

A solder removing system for removing solder adhering to an object, comprising:

• a heater having a flat-shaped upper surface;
• a plate-shaped first member being mounted on said upper surface of a heater and having an upper surface on which the object is placed so as to cause molten solder to adhere thereto;
• a second member being mounted on top of the object for adding a load to the object;
• a suction unit positioned over said heater;
• and
• a moving unit for moving either said heater or said suction unit in a X-Y-Z directions;
• wherein said heater heats said first member and the object to melt the solder and transferring this solder to said first member;
• wherein said moving unit moves either said heater or said suction unit so as to position said suction unit at a location a predetermined distance away from a top surface of said second member;
• and
• wherein said suction unit attracts said second member and the object so as to separate the object from said first member.