Apparatus and method for packaging and integrating microphotonic devices

An apparatus for packaging and integrating microphotonic optical devices comprising a carrier and an optical coupling arrangement, said carrier having a wafer with a predetermined thickness and providing a top surface for supporting a first electrode, said carrier comprising:

• a1) a first cavity having a curved surface with a first portion located near said electrode, said first cavity having predetermined dimensions;
• b1) a second cavity having predetermined dimensions;
• said second cavity having a curved surface with a portion thereof in alignment with a second portion of said curved surface of said first cavity;
• c1) a third cavity have predetermined dimensions;
• said third cavity having a curved surface with a portion thereof in alignment with a second portion of said curved surface of said first cavity;
• d1) a first groove having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said second cavity at a first location thereat;
• and
• e1) a second groove having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said third cavity at a first location thereat;
• said optical coupling arrangement couples light streams to and from a resonator disk dimensioned to snugly fit into said first cavity and comprises:
• a1) a first prism dimensioned to snugly fit into said second cavity;
• b2) a second prism dimensioned to snugly fit into said third cavity;
• c3) a first collimating fiber dimensioned to snugly fit into and run along and occupy said first groove;
• and
• d1) a second collimating fiber dimensioned to snugly fit into and run along and occupy said second groove.

A method providing a carrier particularly suited for microphotonic devices and comprising a wafer with a predetermined thickness and providing a top surface for supporting an electrode, said method comprising the steps of:

• a) providing a first cavity in said wafer and having a curved surface with first, second and third portions all interconnected with each other in a closed loop manner, said first portion located near said electrode, said first cavity having predetermined dimensions;
• b) providing a second cavity in said wafer and having predetermined dimensions, said second cavity having a curved surface with a portion thereof in alignment with said second portion of said curved surface of said first cavity;
• c) providing a third cavity in said wafer and having predetermined dimensions, said third cavity having a curved surface with a portion thereof in alignment with said third portion of said curved surface of said first cavity;
• d) providing a first groove in said wafer and having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said second cavity at a first location thereat;
• and
• e) providing a second groove in said wafer and having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said third cavity at a first location thereat.

A method of providing an apparatus for packaging and integrating microphotonic optical devices comprising providing a carrier and an optical coupling arrangement, said carrier having a wafer with a predetermined thickness and having a top surface for supporting a first electrode, said method for providing said carrier comprising the steps of:

• a1) providing a first cavity in said wafer and having a curved surface with a first portion thereof located near said electrode, said cavity having predetermined dimensions;
• b1) providing a second cavity in said wafer and having predetermined dimensions, said second cavity having a curved surface with a portion thereof in alignment with a second portion of said curved surface of said first cavity;
• c1) providing a third cavity in said wafer and having predetermined dimensions, said third cavity having a curved surface with a portion thereof in alignment with a third portion of said curved surface of said first cavity;
• d1) providing a first groove having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said second cavity at a first location thereat;
• and
• e1) providing a second groove having a predetermined shape and a predetermined depth and running along said top surface of said wafer and intercepting said third cavity at a first location thereat;
• said method for providing said optical coupling arrangement comprising the steps of:
• a2) inserting a resonator disk dimensioned so as to snugly fit into said first cavity;
• b2) inserting a first prism dimensioned so as to snugly fit into said second cavity;
• c2) inserting a second prism dimensioned so as to snugly fit into said third cavity;
• d2) inserting a first collimating fiber dimensioned so as to snugly fit into and run along and occupy said first groove;
• and
• e2) inserting a second collimating fiber dimensioned so as to snugly fit into and run along and occupy said second groove.

A method of providing a carrier particularly suited for microphotonic devices and comprising a wafer with a predetermined thickness and providing a top surface for supporting an electrode, said method comprising the steps of:

• a) providing a first cavity in said wafer having a resonant disk therein, and having a curved surface with a first portion located near said electrode, said wafer being composed of silicon and having a thickness of about 0.5 mm, said first cavity being dimensioned to have a diameter of about 5 mm and a depth of about 50 mm, wherein said resonator disk has a top surface with a predetermined height, said resonator disk having a second electrode thereon on its top surface, and wherein said top surface of said carrier supporting said first electrode is provided as having a thickness selected so that said first and second electrodes are located at substantially the same height;
• b) providing a second cavity in said wafer and being dimensioned to have a trapezoidal shape and dimensions of a base of about 1.1 mm, and a top opening of about 0.6 mm, said second cavity having a curved surface with a portion thereof in alignment with a second portion of said curved surface of said first cavity;
• c) providing a third cavity in said wafer and being dimensioned to have a trapezoidal shape and dimensions of a base of about 1.1 mm, and a top opening of about 0.6 mm, said third cavity having a curved surface with a portion thereof in alignment with a third portion of said curved surface of said first cavity;
• d) providing a first groove in said wafer and being dimensioned to have an U-shape and a depth of at least about 250 um, said first groove running along said top surface of said wafer and intercepting said second cavity at a first location thereat;
• e) providing a second groove in said wafer and being dimensioned to have an U-shape and a depth of at least about 250 um, said second groove running along said top surface of said wafer and intercepting said third cavity at a first location thereat;
• f) providing a third groove in said wafer and having a width of at least about 0.3 mm and running along said top surface of said wafer and intercepting said second cavity at a second location thereat;
• and
• g) providing a fourth groove in said wafer and having a width of at least about 0.3 mm and running along said top surface of said wafer and intercepting said third cavity at a second location thereat.