Integral heat-dissipation system for electronic boards
AssigneeOPTHERM - Thermal Solutions Ltd.
InventorYassour Yuval
Life of this patent
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Abstract
A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the heat-dissipating electronic components, and a plurality of slots provided adjacent each of the plurality of heat-dissipating electronic components. Each slot fluidically communicates with a heat-exchanging device. An adjoining cover defining, with the integrated electronic board, a cavity for providing an integral reservoir between the slots and at least one port that may be connected to a flow generator for generating a flow of a fluidic coolant through said at least one of a plurality of heat-exchanging devices.
Claims28
An integrated electronic board system with integral cooling facility, the system comprising:
- at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices;
- and
- an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices.
A method of cooling heat-dissipating electronic devices, the method comprising:
- providing a system comprising at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices;
- providing an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices;
- and
- using the flow generator to drive a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices.
Dependencies are inferred from the claim text.