Transfer apparatus for transferring an object, lithographic apparatus employing such a transfer apparatus, and method of use thereof

A lithographic apparatus, comprising:

• a support structure configured to support a patterning device that imparts a beam of radiation with a desired pattern;
• a substrate holder configured to hold a substrate;
• a projection system configured to project said patterned beam of radiation onto a target portion of said substrate;
• and
• a transfer apparatus for transferring said patterning device, wherein said transfer apparatus comprises:
• a gripper for at least one of (a) gripping said patterning device at a first position and releasing said patterning device at a second position proximate to said support structure and (b) releasing said patterning device at a first position after gripping said patterning device at a second position proximate to said support structure, and
• a measurement device, separate and displaced from said gripper, configured to measure a relative position of said gripper with respect to said support structure in at least one direction,
• wherein a relative position error is determined with respect to a desired relative position of said gripper with respect to said receiver, the determination based on the measured relative position of said gripper with respect to said receiver, and the relative position of the gripper with respect to said receiver is adjusted based on the reduction of the relative position error at the second position and a difference in relative velocity or acceleration between said gripper and said receiver is minimized.

A lithographic apparatus, comprising:

• a support structure configured to support a patterning device that imparts a beam of radiation with a desired pattern;
• a substrate holder configured to hold a substrate;
• a projection system configured to project said patterned beam of radiation onto a target portion of said substrate;
• and
• a transfer apparatus for transferring said substrate, wherein said transfer apparatus comprises:
• a gripper for at least one of (a) gripping said substrate at a first position and releasing said substrate at a second position proximate to said substrate holder and (b) releasing said substrate at a first position after gripping said substrate at a second position proximate to said substrate holder, and
• a measurement device, separate and displaced from said gripper, configured to measure a relative position of said gripper with respect to said substrate holder in at least one direction,
• wherein a relative position error is determined with respect to a desired relative position of said gripper with respect to said receiver, the determination based on the measured relative position of said gripper with respect to said receiver, and the relative position of the gripper with respect to said receiver is adjusted based on the reduction of the relative position error at the second position and a difference in relative velocity or acceleration between said gripper and said receiver is minimized.

A method of transferring an object via a gripping device, said method comprising:

• gripping with said gripping device at least one of(a) said object at a first position and releasing said object at a second position proximate to a receiving structure and (b) releasing said object at a first position after gripping said object at a second position proximate to said receiving structure,
• measuring a relative position of said gripping device with respect to said receiving structure in at least one direction using a measurement device separate and displaced from said gripping device,
• determining a relative position error with respect to a desired relative position based on the measured relative position, and
• adjusting relative position of said gripping device with respect to said receiving structure to minimize the relative position error and the difference in relative velocity or acceleration between said gripper and said receiver, at the second position.

A device manufacturing method, comprising:

• providing a beam of radiation using a radiation system;
• imparting a desired pattern onto said beam of radiation by a patterning device;
• providing a substrate that is held by a substrate holder;
• transferring said substrate via a gripping device, said transferring including:
• gripping with said gripping device at least one of (a) said substrate at a first position and releasing said substrate at a second position proximate to the substrate holder and (b) releasing said substrate at a first position after gripping said substrate at a second position proximate to the substrate holder,
• measuring a relative position of said gripping device with respect to said substrate holder in at least one direction using a measurement device separate and displaced from said gripping device,
• determining a relative position error with respect to a desired relative position based on the measured relative position, and
• adjusting relative position of said gripping device with respect to said substrate holder to minimize the relative position error and the difference in relative velocity or acceleration between said gripper and said substrate holder, at the second position;
• and
• projecting said patterned beam of radiation onto a target portion of said substrate.

A device manufacturing method, comprising:

• providing a substrate;
• providing a beam of radiation using a radiation system;
• imparting a desired pattern onto said beam of radiation by a patterning device, said patterning device being supported by a support structure;
• transferring said patterning device via a gripping device, said transferring including:
• gripping with said gripping device at least one of (a) said patterning device at a first position and releasing said patterning device at a second position proximate to the support structure and (b) releasing said patterning device at a first position after gripping said patterning device at a second position proximate to the support structure,
• measuring a relative position of said gripping device with respect to said support structure in at least one direction using a measurement device separate and displaced from said gripping device,
• determining a relative position error with respect to a desired relative position based on the measured relative position, and
• adjusting relative position of said gripping device with respect to said support structure to minimize the relative position error and the difference in
• relative velocity or acceleration between said gripper and said support structure, at the second position;
• and
• projecting said patterned beam of radiation onto a target portion of said substrate.