Substantially noiseless cooling device for electronic devices

A computer system comprising:

• an electronic component disposed within an enclosure case;
• a cooling device placed over a surface of an electronic component of the computer system, the cooling device further comprises a carrier having a plurality of openings, a plurality of piezoelectric members each moveably disposed in one of the openings of the carrier, a plurality of conductive wires disposed on the carrier and extending into the openings, wherein the plurality of conductive wires are coupled to the plurality of piezoelectric members;
• and
• an interconnecting member connecting the plurality of conductive wires to a power source, wherein when power is supplied, the piezoelectric members vibrate relative to the carrier which causes the piezoelectric members to be the sole providers of an air jet impingement to dissipate heat generated by the electronic component.

A method to dissipate heat from an electronic component comprising:

• placing a carrier having a plurality of piezoelectric members disposed therein over a surface of the electronic component where heat is generated;
• wherein the piezoelectric members are connected through a plurality of conductive wires disposed through the carrier and wherein the piezoelectric members are configured to vibrate relative to the carrier when power is supplied to the piezoelectric members;
• and
• supplying power to the piezoelectric members, wherein the supplying of power causes the piezoelectric members to be the sole providers of an air jet impingement that impinges on the surface of the electronic component to circulate air, wherein the air jet impingement is significant enough to dissipate heat generated by an electronic component.

A computer system comprising:

• an electronic component disposed within an enclosure case;
• a cooling device placed within the enclosure case which provides a vertical space of only about 2 mm for the cooling device of the computer system, the cooling device further comprises a carrier having a plurality of openings formed in a surface of the carrier, a plurality of piezoelectric members each moveably disposed relative to the openings of the carrier and each defining a plane which is parallel with a plane of the openings and parallel with the surface, a plurality of conductive wires disposed on the carrier and coupled to the plurality of piezoelectric members;
• and
• an interconnecting member connecting the plurality of conductive wires to a power source, wherein when power is supplied, the piezoelectric members vibrate relative to the carrier which causes the piezoelectric members to be the sole providers of an air jet impingement to dissipate heat generated by the electronic component.