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US 7,397,140 B2Granted
Chip module
AssigneesInfineon Technologies AG, Delo Industire Klebstoffe GmbH + Co. KG
InventorsFrank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
Life of this patent
Estimating the term…
Abstract
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
Claims17
A chip module, comprising:
- a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads;
- and
- an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount,
- wherein the encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
1 more element
Dependencies are inferred from the claim text.