Epoxy resin molding material for sealing use and semiconductor device
AssigneeHitachi Chemical Company, Ltd.
InventorsRyoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
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Abstract
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.
Claims25
An encapsulating solid epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) a silica,
- wherein (C) the silica has a maximum diameter size of at least 32 μm, an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more, and
- wherein (C) the silica satisfies the following conditions:
- the amount of particles having a particle size of 12 μm or less is 50% or more by weight;
- the amount of particles having a particle size of 24 μm or less is 70% or more by weight;
- and the amount of particles having a particle size of 32 μm or less is 80% or more by weight;
- the amount of particles having a particle size of 48 μm or less is 90% or more by weight.
An encapsulating solid epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) a silica,
- wherein (C) the silica comprises 5% or more by weight of silica having a maximum particle size of 63 μm or less and particle sizes of 20 μm or more.
An encapsulating solid epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, and satisfying all of the following conditions:
- the glass transition temperature based on TMA method is 150° C. or higher;
- the bending modulus based on JIS-K 6911 is 19 GPa or less;
- and the mold shrinkage ratio based on JIS-K 6911 is 0.2% or less.
Dependencies are inferred from the claim text.