Multi-chip module and single-chip module for chips and proximity connectors

#1. Field of the Invention

#The present invention relates to packaging techniques for semiconductor dies. More specifically, the present invention relates to single-chip and multi-chip modules for semiconductor dies that communicate signals using proximity connections.

#2. Related Art

#FIG. 1A is a block diagram illustrating an embodiment of a single-chip module.

#FIG. 1B is a block diagram illustrating an embodiment of a single-chip module.

#FIG. 2 is a block diagram illustrating a cross-sectional view of an embodiment of a semiconductor die.

#Like reference numerals refer to corresponding parts throughout the drawings.

#The following description is presented to enable any person skilled in the art to make and use the invention, and is provided in the context of a particular application and its requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

#Embodiments of a single-chip module (SCM) and a multi-chip module (MCM) are disclosed. The SCM and the MCM represent solutions to numerous, coupled packaging challenges. The SCM includes one or more semiconductor dies. A semiconductor die includes integrated circuit electronics corresponding to layers deposited on a semiconductor substrate. When packaged, for example in the SCM, the one or more semiconductor dies is sometimes referred to as a chip. The MCM is well-suited for mounting two or more SCMs with limited misalignment, i.e., substantially accurate alignment, thereby enabling communication of data signals between the two or more SCMs using proximity connectors. In some embodiments, the MCM may reliably and economically align two or more proximity connectors in a first dimension (X), a second dimension (Y), and/or a third dimension (Z) within a few microns. In some embodiments, the MCM may be aligned in six degrees of freedom, including the first dimension (X), the second dimension (Y), the third dimension (Z), an angle in a plane defined by the first dimension (X) and the second dimension (Y), an angle in a plane defined by the first dimension (X) and the third dimension (Z), and an angle in a plane defined by the second dimension (Y) and the third dimension (Z). This capability may be of use for densely packed proximity connectors, i.e., connectors having a small spacing or pitch between adjacent pads.