Semiconductor device mounted on and electrically connected to circuit board

A semiconductor device mounted on a circuit board having an external electrode, comprising;

• a semiconductor die comprising a top surface on which a device element is formed;
• a pad electrode disposed on the top surface;
• a supporting member disposed on the top surface and having an opening, the pad electrode and the external electrode being electrically connected through the opening;
• and
• a conductive terminal disposed in the opening so as to be in physical contact with the pad electrode and to protrude from a top surface of the supporting member,
• wherein the semiconductor die is mounted on the circuit board so that a bottom surface of the semiconductor die is closer to the circuit board than the top surface, and
• the conductive terminal and the external electrode are connected by an external connection wiring.

A semiconductor device mounted on a circuit board having an external electrode, comprising:

• a semiconductor die comprising a top surface on which a device element is formed;
• a pad electrode disposed on the top surface;
• a supporting member disposed on the top surface and having an opening, the pad electrode and the external electrode being electrically connected through the opening, and;
• a peripheral pad electrode that is disposed on the top surface at a peripheral portion of the semiconductor die;
• a peripheral conductive terminal that is disposed in another opening of the supporting member formed at the peripheral portion and in electric contact with the peripheral pad electrode;
• and
• a wiring layer connecting the pad electrode and the peripheral conductive terminal,
• wherein the semiconductor die is mounted on the circuit board so that the top surface is closer to the circuit board than a bottom surface of the semiconductor die, and the peripheral conductive terminal is in contact with the external electrode.

A semiconductor device mounted on a circuit board having an external electrode, comprising:

• a semiconductor die comprising a top surface on which a device element is formed;
• a pad electrode disposed on the top surface;
• a resin layer formed on the top surface and having an opening, the pad electrode and the external electrode being electrically connected through the opening;
• a peripheral pad electrode that is disposed on the top surface at a peripheral portion of the semiconductor die;
• a peripheral conductive terminal that is disposed in another opening of the resin layer formed at the peripheral portion and in electric contact with the peripheral pad electrode;
• and
• a wiring layer connecting the pad electrode and the peripheral conductive terminal,
• wherein the semiconductor die is mounted on the circuit board so that the top surface is closer to the circuit board than a bottom surface of the semiconductor die, and the peripheral conductive terminal is in contact with the external electrode.

A semiconductor device assembly comprising;

• a semiconductor device comprising a semiconductor die comprising a top surface on which a device element is formed, a pad electrode disposed on the top surface, a supporting member disposed on the top surface and having an opening;
• a circuit board on which the semiconductor device is mounted, the circuit board comprising an external electrode and having a recess in which the semiconductor device is disposed, the pad electrode and the external electrode being electrically connected through the opening;
• a conductive terminal disposed in the opening and in electric contact with the pad electrode;
• and
• a filling portion filling a space between a side of the semiconductor die and a side wall of the recess,
• wherein a bottom surface of the semiconductor die is attached to a bottom of the recess,
• the conductive terminal and the external electrode are connected by an external connection wiring, and
• the external connection wiring is formed by printing conductive paste on the semiconductor die, the filling portion and the external electrode.

A semiconductor device assembly comprising:

• a semiconductor device comprising a semiconductor die comprising a top surface on which a device element is formed, a pad electrode disposed on the top surface, a supporting member disposed on the top surface and having an opening;
• a circuit board on which the semiconductor device is mounted, the circuit board comprising an external electrode and having a recess in which the semiconductor device is disposed, the pad electrode and the external electrode being electrically connected through the opening;
• a peripheral pad electrode that is disposed on the top surface at a peripheral portion of the semiconductor die;
• a peripheral conductive terminal that is disposed in another opening of the supporting member formed at the peripheral portion and in electric contact with the peripheral pad electrode;
• a wiring layer connecting the pad electrode and the peripheral conductive terminal;
• and
• a patterned metal layer embedded in the circuit board,
• wherein the peripheral conductive terminal is in contact with the patterned metal layer at a bottom of the recess.

A semiconductor device assembly comprising;

• a semiconductor device comprising a semiconductor die comprising a top surface on which a device element is formed, a pad electrode disposed on the top surface, and a resin layer formed on the top surface and having an opening;
• a circuit board on which the semiconductor device is mounted, the circuit board comprising an external electrode and having a recess in which the semiconductor device is disposed, the pad electrode and the external electrode being electrically connected through the opening;
• and
• a filling portion filling a space between a side of the semiconductor die and a side wall of the recess,
• wherein the external connection wiring is formed by printing conductive paste on the semiconductor die, the filling portion and the external electrode, and
• a bottom surface of the semiconductor die is attached to a bottom of the recess, and the pad electrode is electrically connected with an external connection wiring that is physically connected with the external electrode.

A semiconductor device assembly comprising:

• a semiconductor device comprising a semiconductor die comprising a top surface on which a device element is formed, a pad electrode disposed on the top surface, and a resin layer formed on the top surface and having an opening;
• a circuit board on which the semiconductor device is mounted, the circuit board comprising an external electrode and having a recess in which the semiconductor device is disposed, the pad electrode and the external electrode being electrically connected through the opening;
• a peripheral pad electrode that is disposed on the top surface at a peripheral portion of the semiconductor die;
• a peripheral conductive terminal that is disposed in another opening of the resin layer formed at the peripheral portion and in electric contact with the peripheral pad electrode;
• a wiring layer connecting the pad electrode and the peripheral conductive terminal;
• and
• a patterned metal layer embedded in the circuit board,
• wherein the peripheral conductive terminal is in contact with the patterned metal layer at a bottom of the recess.