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US 7,397,120 B2Granted
Semiconductor package structure for vertical mount and method
AssigneeSemiconductor Components Industries, LLC
InventorsStephen St. Germain, Francis J. Carney, Bruce Alan Huling
Life of this patent
Estimating the term…
Abstract
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.
Claims18
A semiconductor package structure comprising:
- first and second clips each having an end configured for mounting the semiconductor package structure in a perpendicular orientation with respect to a next level of assembly;
- a semiconductor chip interposed between the first and second clips, the first clip coupled to one major surface of the semiconductor chip, and the second clip coupled to another major surface of the semiconductor chip;
- a third clip interposed between the first and second clips and coupled to one of the major surfaces of the semiconductor chip, wherein the third upright clip has an end configured for mounting the semiconductor package in a perpendicular orientation with respect to the next level of assembly;
- a first spacer interposed between the first and third clips;
- and
- a second spacer interposed between the second and third upright clips.
3 more elements
A power semiconductor package comprising:
- a power semiconductor chip having first and second opposing major surfaces;
- a first clip attached to the first major surface;
- a second clip attached to the second major surface;
- a third clip attached to the second major surface;
- a first spacer interposed between the first and second clips;
- and
- a second spacer interposed between the second and third clips, wherein each of the first, second, and third clips has an end portion for mounting to a next level of assembly so that the first and second major surfaces of the power semiconductor chip are perpendicular to the next level of assembly when attached thereto, and wherein at least one of the first and second spacers is insulative.
4 more elements
A method for forming a semiconductor package comprising the steps of:
- providing a semiconductor chip having first and second opposing major surfaces;
- attaching a first clip to the first major surface;
- attaching a first spacer to the first clip;
- attaching a second clip to the second major surface and the first spacer;
- attaching a second spacer to the second clip, wherein at least one of the first and second spacers is insulative;
- and
- attaching a third clip to the second major surface and the second spacer, wherein each of the first, second, and third clips has an end portion for mounting to a next level assembly, and to orient the first and second major surfaces of the semiconductor chip perpendicular with respect to the next level of assembly.
4 more elements
Dependencies are inferred from the claim text.