Semiconductor package and lead frame therefor

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein at least one recess is formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein at least one through hole is formed to run through the lead in its thickness direction at a prescribed position allowing a cutting line, by which the leads are electrically isolated from each other, to pass therethrough.

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein at least one recess is formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein at least one through hole is formed to run through the lead interconnecting member in its thickness direction at a prescribed position allowing a cutting line, by which the leads are electrically isolated from each other, to pass therethrough.

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein at least one recess is formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein at least one through hole is formed to run through the lead interconnecting member in its thickness direction at a prescribed position allowing a cutting line, by which the leads are electrically isolated from each other, to pass therethrough,
• wherein the through hole is enlarged in a direction for alignment of a prescribed number of the leads.

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein a plurality of recesses are formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein a plurality of recesses are formed on at least one of the plurality of leads that are isolated from each other by way of cutting.

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein at least one recess is formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein the recess is opened in the side surface of the lead.

A lead frame that is adapted to a semiconductor package enclosed in a molded resin body and that is formed by processing a thin metal plate, said lead frame comprising:

• a stage on which a semiconductor chip is mounted;
• a plurality of leads that are arranged to encompass the stage and that are partially exposed to a terminal surface lying in a thickness direction of the molded resin body;
• and
• a plurality of lead interconnecting members for connecting the leads together,
• wherein at least one recess is formed in at least one of the plurality of leads with respect to the terminal surface of the molded resin body,
• wherein a projection projects from the terminal surface of the recess.