Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
AssigneeInfineon Technologies AG
InventorsSimon Jerebic, Jens Pohl, Horst Theuss
Life of this patent
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Abstract
An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.
Claims17
An electronic component comprising:
- a semiconductor chip including a chip topside, an integrated circuit, and a chip backside;
- and
- a chip carrier including a carrier topside and a carrier backside, the carrier topside carrying the semiconductor chip;
- wherein each of the chip backside and the carrier topside comprises a magnetic layer, and at least one of the magnetic layers is permanently magnetic.
A semiconductor wafer comprising:
- semiconductor chip positions arranged in rows and columns;
- a wafer topside including integrated circuits in the semiconductor chip positions;
- and
- a wafer backside including a magnetic layer that is patterned in the semiconductor chip positions and magnetized into a plurality of permanently magnetic regions including at least some regions that are differently polarized with respect to each other.
A semiconductor wafer comprising:
- semiconductor chip positions arranged in rows and columns;
- a wafer topside including integrated circuits in the semiconductor chip positions;
- and
- a wafer backside including a magnetic layer, wherein the magnetic layer is patterned with regions of different polarity, the regions of different polarity being arranged with radial symmetry and/or concentrically.
A component carrier comprising component positions arranged in rows and columns, wherein the component positions comprise chip carriers with chip carrier topsides and chip carrier backsides, the chip carrier topsides comprise a magnetic layer, and the magnetic layer comprises a permanently magnetic structure.
A method for producing a semiconductor wafer with a number of semiconductor chip positions for a number of electronic components, the method comprising:
- providing a semiconductor wafer including semiconductor chip positions arranged in rows and columns, and the semiconductor wafer further including a wafer topside and a wafer backside;
- applying a magnetic layer to the wafer backside;
- patterning the magnetic layer in the semiconductor chip positions;
- and
- magnetizing the patterned magnetic layer into a plurality of permanently magnetic regions including at least some regions that are differently polarized with respect to each other.
A method for producing a component carrier with a number of component positions for a number of electronic components, the method comprising:
- providing a component carrier blank including component positions arranged in rows and columns, the component carrier blank further including a component carrier topside and a component carrier backside;
- applying a magnetic layer to the component carrier topside;
- patterning the magnetic layer in the component positions;
- and
- magnetizing the patterned magnetic layer into a plurality of permanently magnetic regions including at least some regions that are differently polarized with respect to each other.
A method for producing electronic components with semiconductor chips, the method comprising:
- providing a semiconductor wafer including semiconductor chip positions arranged in rows and columns, and the semiconductor wafer further including a wafer topside and a wafer backside;
- applying a magnetic layer to the wafer backside;
- separating the semiconductor wafer into individual semiconductor chips;
- providing a component carrier blank including component positions arranged in rows and columns, the component carrier blank further including a component carrier topside and a component carrier backside;
- applying a permanently magnetic layer to the component carrier topside;
- applying the semiconductor chips with the magnetic layers of the backsides of the semiconductor chips to the permanently magnetic layer of the component carrier topside in the component positions;
- wiring the semiconductor chips with corresponding external contact structures;
- packaging the semiconductor chips in the component positions to form electronic components;
- and
- separating the component positions of the component carrier into individual electronic components.
Dependencies are inferred from the claim text.