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US 7,397,066 B2Granted
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
AssigneeMicron Technology, Inc.
InventorSteven D. Oliver
Life of this patent
Estimating the term…
Abstract
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
Claims36
A microelectronic imager device, comprising:
- an imager die having a substrate, a microelectronic image sensor having a face with a continuous convex and/or concave first surface for receiving radiation at one side of the substrate, integrated circuitry in the substrate operatively connected to the image sensor, and external contacts electrically coupled to the integrated circuitry;
- a cover over the face of the image sensor;
- and
- a compartment under a backside of the substrate or over the image sensor, and a fluid in the compartment at a pressure that causes the substrate to bow.
1 more element
A microelectronic imager device, comprising:
- an imager die having a substrate, a microelectronic image sensor having a face with a continuous convex and/or concave first surface for receiving radiation at one side of the substrate, integrated circuitry in the substrate operatively connected to the image sensor, and external contacts electrically coupled to the integrated circuitry;
- a cover over the face of the image sensor;
- and
- a material attached to a backside of the substrate, wherein the material exerts a force that bows the substrate.
1 more element
A microelectronic imager device, comprising:
- an imager die having a substrate, a microelectronic image sensor having a continuous face with a continuous convex and/or concave contoured portion first surface for receiving radiation at one side of the substrate, integrated circuitry in the substrate operatively connected to the image sensor, and external contacts electrically coupled to the integrated circuitry;
- and
- a cover over the face of the image sensor,
- wherein the cover has a higher coefficient of thermal expansion than the substrate.
1 more element
A microelectronic imager device, comprising:
- an imager die having a substrate, a microelectronic image sensor having a continuous face with a continuous convex and/or concave contoured portion first surface for receiving radiation at one side of the substrate, integrated circuitry in the substrate operatively connected to the image sensor, and external contacts electrically coupled to the integrated circuitry;
- a cover over the face of the image sensor;
- and
- a compartment under a backside of the substrate or over the image sensor, and a fluid in the compartment, at a pressure that causes the substrate to bow.
1 more element
A microelectronic imager device, comprising:
- an imager die having a substrate with a bowed portion, a microelectronic image sensor having a face with a continuous convex and/or concave first surface for receiving radiation, the first surface being contoured to the bowed portion of the substrate, and integrated circuitry electrically coupled to the image sensor;
- a cover over the image sensor;
- and
- a material attached to a backside of the substrate that exerts a force that bends the substrate.
1 more element
A microelectronic imager device, comprising:
- an imager die having a substrate with a bowed portion, a microelectronic image sensor having a face with a continuous convex and/or concave first surface for receiving radiation, the first surface being contoured to the bowed portion of the substrate, and integrated circuitry electrically coupled to the image sensor;
- and
- a cover over the image sensor,
- wherein the cover has a higher coefficient of thermal expansion than the substrate.
1 more element
A microelectronic workpiece, comprising:
- a substrate having a plurality of bowed regions and imager dies at the bowed regions, wherein individual imager dies include an image sensor having a face with a continuous curved first surface for receiving radiation, the first surface being contoured to a corresponding bowed region. and an integrated circuit operatively coupled to the image sensor;
- a cover over the substrate;
- and
- a plurality of backside flexors units, wherein individual flexor units comprise:
- a pair of first and second expansion/contraction elements at an individual imaging die, and
- wherein the first and second expansion/contraction elements change dimensions to flex the substrate under a corresponding image sensor.
3 more elements
A microelectronic workpiece, comprising:
- a substrate having a plurality of bowed regions and imager dies at the bowed regions, wherein individual imager dies include an image sensor having a face with a continuous curved first surface for receiving radiation, the first surface being contoured to a corresponding bowed region, and an integrated circuit operatively coupled to the image sensor;
- a cover over the substrate;
- and
- a plurality of compartments under a backside of the substrate or over the image sensors at corresponding imager dies, wherein the compartments contain a fluid at a pressure that causes the substrate to bow.
1 more element
A microelectronic workpiece, comprising:
- a substrate having a plurality of bowed regions and imager dies at the bowed regions, wherein individual imager dies include an image sensor having a face with a continuous curved first surface for receiving radiation, the first surface being contoured to a corresponding bowed region, and an integrated circuit operatively coupled to the image sensor;
- a cover over the substrate;
- and
- a material attached to the backside of the substrate that bends portions of the substrate under the image sensors.
1 more element
Dependencies are inferred from the claim text.