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US 7,396,754 B2Granted
Method of making wafer level ball grid array
AssigneeNational Semiconductor Corporation
InventorsLee Cheong Chee, Sri Ganesh A/L A. Tharumalingam
Life of this patent
Estimating the term…
Abstract
A manufacturing technique that involves embedding one or more semiconductor die into a support substrate and forming conductive traces that lead from die contact pads to redistributed contact pads on the support substrate. Active surfaces of the dice and a working surface of the support substrate are substantially coplanar and the conductive traces are formed on the coplanar surfaces. The redistributed contact pads are sufficiently spaced apart from each other so that conductive balls can be formed thereon. Individual semiconductor device packages are singulated from the support substrate.
Claims10
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape;
- placing a stencil around the semiconductor dice and onto the adhesive tape;
- applying a molding material within the stencil;
- and
- curing the molding material in order to form the support substrate.
5 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape;
- placing the adhesive tape and corresponding dice into a molding chamber of a molding device;
- and
- injecting molding material into the molding chamber in order to form the support substrate.
4 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape;
- and
- placing each semiconductor die within a respective receiving pocket within a tray wherein the receiving pockets are arranged within an array of rows and columns.
3 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- and
- attaching the active surface of each semiconductor die onto an adhesive tape, wherein the semiconductor dice are placed upon the adhesive tape within a wafer-like region.
2 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads, wherein the molding operation involves molding the support substrate such that the active surface of each die is substantially coplanar with the working surface of the support substrate;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape;
- and
- depositing a filler material into a crack between a semiconductor die and the support substrate such that the interface between the active surface of each die and the working surface of the support substrate is substantially flat.
3 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad wherein the operation of forming conductive traces is performed using photolithographic techniques;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape;
- covering the active surface of each die and the working surface of the support substrate with a conductive material layer and a photoresist layer, wherein the photoresist layer is on top of the conductive material layer;
- removing a portion of the photoresist layer;
- and
- removing a portion of the conductive material layer such that the remaining portion of the conductive material layer forms the conductive traces.
5 more elements
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad, wherein the operation of forming conductive traces is performed using photolithographic techniques and wherein the operation of forming conductive traces forms each of the conductive traces substantially within a single plane;
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace;
- attaching the active surface of each semiconductor die onto an adhesive tape.
1 more element
Dependencies are inferred from the claim text.