Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

A process of manufacturing a semiconductor package substrate having bonding pads with a plated metal layer thereon, comprising:

• providing a substrate having a plurality of bonding pads on at least one surface thereof, and forming a conductive film over the surface of the substrate;
• forming a photoresist layer over the conductive film, wherein the photoresist layer has a plurality of first openings corresponding in position to the bonding pads, and an extension portion extending from an inner wall of each of the first openings to partly cover a portion of the conductive film exposed via the corresponding first opening;
• removing the part of the conductive film not covered by the photoresist layer, so as to expose the bonding pads respectively via the first openings;
• performing a plating process to form a plated metal layer on the exposed bonding pads respectively;
• and
• removing the photoresist layer and the remainder of the conductive film covered by the photoresist layer.