Method for connecting substrate and composite element
AssigneeSchott AG
InventorsDietrich Mund, Jürgen Leib
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Abstract
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.
Claims19
A process for joining at least two substrates having electrical, semiconducting, mechanical and/or optical components, comprising the steps of:
- providing a first substrate;
- producing a joining element in the form of a frame on a first surface of the first substrate, the frame being made of a material selected from the group consisting of a binary system of materials, a glass, and a vitreous material, and the material being applied by evaporation coating, wherein the step of producing the joining element comprises structuring the joining element by a lift-off technique comprising patterning a photoresist-layer, applying the material by evaporation coating, dissolving the photoresist-layer to remove the evaporated layer thereon;
- providing a second substrate;
- and
- joining the first and second substrates by the joining element.
A process for joining substrates having electrical or optical components, comprising:
- providing a first substrate and a second substrate;
- in a first step, applying a frame to at least one surface of the first substrate, glass being used as material for the frame and the glass being applied by evaporation coating, wherein the step of applying the frame comprises structuring a glass layer by a lift-off technique comprising patterning a photoresist-layer, applying the material by evaporation coating, and dissolving the photoresist-layer to remove the evaporated layer thereon;
- and
- in a second, subsequent step, joining or bonding a surface of the second substrate to the frame so that a cavity is formed between the first and second substrates and inside the frame.
A process for joining at least two substrates having electrical, semiconducting, mechanical and/or optical components, comprising the steps of:
- providing a first substrate;
- producing a plurality of nested frame joining elements on a first surface of the first substrate, said plurality of nested frame joining elements being nested inside one another;
- providing a second substrate;
- and
- joining the first and second substrates by the plurality of nested frame joining elements.
A composite element having electrical, electronic, semiconducting, mechanical and/or optical components, comprising:
- a first substrate;
- a joining element on a first surface of the first substrate;
- a second substrate, the first and second substrates being joined by the joining element;
- and
- a plurality of nested frames being provided as the joining element, said plurality of nested frame joining elements being nested inside one another.
Dependencies are inferred from the claim text.