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US 7,396,703 B1Granted
Method of making a semiconductor chip assembly with a bumped terminal and a filler
AssigneeBridge Semiconductor Corporation
InventorsCharles W. C. Lin, Cheng-Chung Chen
Life of this patent
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Abstract
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.
Claims100
A method of making a semiconductor chip assembly, comprising:
- providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the metal base, the bumped terminal and the filler, the bumped terminal contacts the metal base in a recess in the metal base and includes a cavity that extends into and faces away from the recess, and the filler contacts the bumped terminal in the cavity and extends into the recess;
- then
- mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the filler in the second direction, the routing line extends laterally beyond the bumped terminal and the filler and contacts the filler within a periphery of the cavity, the bumped terminal extends vertically beyond the routing line and the filler in the second direction, the filler extends vertically beyond the routing line in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
- etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the filler;
- and then
- grinding the bumped terminal, thereby exposing the filler in the cavity such that the cavity extends through the bumped terminal in the second direction.
5 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a metal base;
- then
- forming a recess in the metal base;
- then
- forming a bumped terminal that contacts the metal base in the recess and includes a cavity that extends into and faces away from the recess;
- then
- forming a filler that contacts the bumped terminal in the cavity and extends into the recess;
- then
- forming a routing line that contacts the metal base, the bumped terminal and the filler;
- then
- mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the filler in the second direction, the routing line extends laterally beyond the bumped terminal and the filler towards the chip and contacts the filler within a periphery of the cavity, the bumped terminal extends vertically beyond the routing line and the filler in the second direction, the filler extends vertically beyond the routing line in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
- etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the filler;
- and then
- grinding the bumped terminal, thereby exposing the filler in the cavity such that the cavity extends through the bumped terminal in the second direction.
13 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a metal base;
- then
- forming a recess in the metal base;
- then
- forming a bumped terminal that contacts the metal base in the recess and includes a cavity that extends into and faces away from the recess;
- then
- forming a filler that contacts the bumped terminal in the cavity and extends into the recess;
- then
- forming a routing line that contacts the metal base, the bumped terminal and the filler;
- then
- mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the filler in the second direction, the routing line extends laterally beyond the bumped terminal and the filler towards the chip and contacts the filler within a periphery of the cavity, the bumped terminal extends vertically beyond the routing line and the filler in the second direction, the filler extends vertically beyond the routing line in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
- etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the filler;
- then
- forming an insulative base that covers and extends vertically beyond the chip, the routing line, the bumped terminal and the filler in the second direction;
- and then
- grinding the insulative base without grinding the bumped terminal and without grinding the filler, then grinding the insulative base and the bumped terminal without grinding the filler, and then grinding the insulative base, the bumped terminal and the filler, thereby exposing the filler in the cavity such that the cavity extends through the bumped terminal in the second direction and the bumped terminal, the cavity, the filler and the insulative base are laterally aligned with one another at a lateral surface that faces in the second direction.
15 more elements
Dependencies are inferred from the claim text.