Wiring substrate
AssigneeJapan Aviation Electronics Industry, Limited
InventorsTakuya Miyashita, Masafumi Okada, Kenji Matsumoto
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Abstract
In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact portion is electrically connected to the external element through the organic thing film. Unlike conventional wiring substrates in which a contact portion is uncovered by ripping open or cutting away a protective resin film formed on the contact portion, the wiring substrate can be electrically connected with an external element having a low contact pressure, for example.
Claims4
A wiring substrate for electrical connection with a terminal of an external element, comprising:
- an insulating substrate;
- a metal wiring pattern formed on a surface of the insulating substrate;
- and
- an organic thin film of a thickness less than 5 μm which is formed on the insulating substrate to cover the metal wiring pattern and contains a polyester silane or a polyvinyl silane;
- wherein the metal wiring pattern is for electrical connection to the terminal of the external element through the organic thin film in a portion of the surface of the organic thin film that is to be in contact with the terminal of the external element.
Dependencies are inferred from the claim text.