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US 7,396,575 B2Granted
Molding die apparatus, method for disc substrate, and disc-shaped recording medium
AssigneeSony Corporation
InventorYoshihito Fukushima
Life of this patent
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Abstract
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die 1 includes a pair of stationary die 6 and movable die 7, and an outer circumference ring 16 for molding an outer circumference end of the disc substrate 2. The outer circumference ring 16 is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die 7 toward the stationary die 6, and has a retaining surface 39 for retaining the outer circumference of the molded disc substrate 2.
Claims2
A disc-shaped recording medium comprising:
- a substrate including
- a first surface;
- a second surface parallel to the first surface;
- and
- at least one end surface extending between the first and second surfaces;
- wherein the end surface includes (a) an inclined surface extending at a single angle in a thickness direction of the substrate transversely from the first surface toward the second surface, (b) a vertical surface extending perpendicular from the second surface toward the first surface and (c) a retaining surface formed in parallel with the second surface and extending between the vertical surface and the inclined surface,
- wherein the end surface is formed such that a diameter of the substrate increases toward the first surface.
4 more elements
Dependencies are inferred from the claim text.