Ceramic thin film on various substrates, and process for producing same
AssigneeSixtron Advanced Materials, Inc.
InventorsMihai Scarlete, Cetin Aktik
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AssigneeSixtron Advanced Materials, Inc.
InventorsMihai Scarlete, Cetin Aktik
Estimating the term…
The process of Polymer Assisted Chemical Vapor Deposition (PACVD) and the semiconductor, dielectric, passivating or protecting thin films produced by the process are described. A semiconductor thin film of amorphous silicon carbide is obtained through vapor deposition following desublimation of pyrolysis products of polymeric precursors in inert or active atmosphere. PA-CVD allows one or multi-layers compositions, microstructures and thicknesses to be deposited on a wide variety of substrates. The deposited thin film from desublimation is an n-type semiconductor with a low donor concentration in the range of 1014-1017 cm−3. Many devices can be fabricated by the PA-CVD method of the invention such as; solar cells; light-emitting diodes; transistors; photothyristors, as well as integrated monolithic devices on a single chip. Using this novel technique, high deposition rates can be obtained from chemically synchronized Si—C bonds redistribution in organo-polysilanes in the temperature range of about 200-450° C.
A method of depositing a thin ceramic film onto a substrate comprising:
Dependencies are inferred from the claim text.