Method of production of peeling layer paste and method of production of multilayer type electronic device

A method of production of a peeling layer paste used for producing a multilayer electronic device,

• said method of production of a peeling layer paste having:
• a step of preparing a primary slurry containing a ceramic powder having an average particle size of 0.1 μm or less, a binder, and a dispersion agent and having a nonvolatile concentration of 30 wt % or more,
• a first high pressure dispersion treatment step of running said primary slurry through a wet jet mill to apply to said primary slurry a shear rate of 1.5×106 to 1.3×107 (1/s),
• a step of adding to the slurry after said first high pressure dispersion treatment a binder-lacquer solution to dilute the slurry after said first high pressure dispersion treatment and prepare a secondary slurry having a nonvolatile concentration of 15 wt % or less and a content of said binder of 12 parts by weight or more with respect to 100 parts by weight of said ceramic powder, and
• a second high pressure dispersion treatment step of running said secondary slurry through a wet jet mill again to apply to said secondary slurry a shear rate of 1.5×106 to 1.3×107 (1/s).