System and method for optimizing wafer flatness at high rotational speeds

A system capable of receiving a wafer and capable of rotating, a first region being formed by an area between a chuck and the wafer, a second region being adjacent to the wafer on a side of the wafer opposite the first region, the chuck comprising:

• vacuum groove means for providing a low pressure suction force at a first end, said first end capable of securing the wafer;
• venturi hole means within said chuck for lowering an air pressure in the first region in response to a rotation of said chuck;
• air inlet hole means within said chuck for increasing the air pressure in the first region when said chuck rotates;
• a plurality of inlet hole means, wherein a size of at least some of the plurality of inlet hole means that are closer to a center of the chuck are larger than a size of other ones of the plurality of inlet hole means that are farther from the center of the chuck,
• wherein said pressure in said first region is reduced using said venturi hole means and said air inlet hole means to substantially match a pressure of the said second region, wherein the air inlet hole means has a larger opening than the venturi hole means.