US 7,395,173 B2Granted

Temperature sensing device

AssigneeJohnson Controls Technology Company

InventorsThomas O. Kautz, Dominic Ticali, Robert R. Freimuth, II

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Abstract

The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.

Claims14

Dependent claims

A temperature sensing device, comprising:

a housing;
a first temperature sensor mounted within the housing at a first location near a first surface of the housing and configured to sense a first temperature;
a second temperature sensor configured to sense a second temperature;
a processor circuit coupled to the first and second temperature sensors;
and
a mounting device coupled to at least one of the housing and the processor circuit configured to mount the second temperature sensor at a second location near a second surface of the housing and spaced apart from the first surface;
wherein the processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations, wherein the third temperature is an estimate of a temperature at a third location, and wherein the distance between the first and third location is greater than the distance between the first and second locations.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/241,846Filed 30 Sep 2005 · continuation in part
Priority: 16 Mar 2004
Published: US 2006/0074586 A16 Apr 2006
Granted: 1 Jul 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 1/147
Structural association of two or more printed circuits: at least one of the printed circuits being bent or folded, e.g. by using a flexible…
G01K 7/42
Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using…: circuits…
G01K 7/427
Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature: temperature calculation based…
G01K 17/20
Based upon measurement of temperature difference or of a temperature: across a radiating surface, combined with ascertainment of the…