Method and apparatus for inspecting pattern defects
AssigneeHitachi High-Technologies Corporation
InventorsKaoru Sakai, Shunji Maeda, Takafumi Okabe
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AssigneeHitachi High-Technologies Corporation
InventorsKaoru Sakai, Shunji Maeda, Takafumi Okabe
Estimating the term…
The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.
An apparatus for inspecting pattern defects, the apparatus comprising:
An apparatus for inspecting pattern defects, the apparatus comprising:
A method for inspecting pattern defects, the method comprising:
A method for inspecting pattern defects, the method comprising:
Dependencies are inferred from the claim text.