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US 7,387,119 B2Granted
Dicing saw with variable indexing capability
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
Life of this patent
Estimating the term…
Abstract
A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.
Claims20
A semiconductor substrate singulation saw, comprising:
- a substrate support, the substrate support including a substantially planar surface;
- and
- at least two substantially parallel saw blades having respective centers of rotation along a substantially common axis when in cutting positions and at least one blade of the at least two substantially parallel saw blades being laterally translatable relative to at least one other of the at least two substantially parallel saw blades.
An apparatus for singulating a semiconductor substrate, comprising:
- a substrate support;
- and
- at least two substantially parallel saw blades with centers of rotation along a substantially
- common axis when in cutting positions above the substrate support, at least one of the at least two substantially parallel saw blades being laterally translatable relative to another of the at least two substantially parallel saw blades.
1 more element
An apparatus for singulating a semiconductor substrate, comprising:
- a substrate support;
- and
- at least two substantially parallel saw blades with centers of rotation along a substantially common axis when in cutting positions above the substrate support, at least one of the at least two substantially parallel saw blades being independently raisable with respect to another of the at least two substantially parallel saw blades.
Dependencies are inferred from the claim text.